Siliconova is seeking an IC Package Design Engineer with expertise in Material Science, Metallurgy, and IC Package Engineering to join our growing team.
Key Highlights
Technical Skills Required
Benefits & Perks
Job Description
We’re Hiring: IC Package Design Engineer
Position: IC Package Design Engineer
We are seeking passionate engineers with strong interest and expertise in Material Science, Metallurgy, Basic Electronics and IC Package Engineering to join our growing team.
Key Responsibilities
- IC package layout and substrate design
- Mechanical and material design for advanced IC packages
- Material engineering analysis for package reliability and performance
- Signal Integrity (SI) and Power Integrity (PI) analysis
- Power Delivery Network (PDN) design and optimization
- Collaboration with cross-functional teams including silicon, system, and manufacturing engineers
- Support package development from concept through production
Preferred Background & Skills
- Bachelor’s / Master’s degree in: Material Science & Engineering, Mechanical Engineering, Electronics / Semiconductor-related disciplines
- Strong interest or experience in: IC package & substrate design, Mechanical design for semiconductor packaging, Material selection and characterization, SI/PI analysis and PDN design, Knowledge of semiconductor packaging technologies is a plus
- Strong analytical, problem-solving, and teamwork skills
Fresher University Graduates are highly encouraged to apply
Application with relevant experience will get preference
What We Offer
- Work with cutting-edge semiconductor technologies
- Exposure to global projects and teams
- Clear career growth and international relocation opportunities
- Dynamic and innovation-driven work environment
📩 How to Apply
Send your updated CV to hr@siliconova.com
📌 Subject line: IC Package Design Engineer Application
(Application might not be accepted if subject line doesn't match)
Application Deadline: 10th January 2026
Company Description
SILICONOVA Limited is a leading semiconductor design company delivering next-generation solutions in advanced IC packaging and system integration. We work at the intersection of materials engineering, mechanical design, and high-performance electronics, enabling reliable and scalable semiconductor products for global markets.
Siliconova specializes in the design, packaging, and testing of advanced semiconductor devices, including CPUs, MCUs, RISC and RISC-V processors, AI processors, memory, ASICs, SOCs, and FPGAs for diverse applications. Our technology powers essential devices across industries such as IoT, wireless communications, automotive, 5G, and PC computing. We are dedicated to creating high-performance, low-power 32/64-bit processors and their associated SoCs to cater to the rapidly evolving embedded systems market globally. Our commitment to innovation positions us as a key player in shaping next-generation technologies.
As we continue to expand, SILICONOVA offers long-term global career growth, with future relocation opportunities to:
- 🇲🇾 Penang
- 🇩🇪 Munich
- 🇺🇸 California
Hiring Procedure:
Initial Screening (CV Sorting/ Interview Call/Short Assessment) >> 2 months' bootcamp >> Final Placement